Assembly and Packaging Process Engineer

**About Lyte**

• Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit [www.lyte.ai](http://www.lyte.ai)

**If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!**

**About the role**

• We are seeking an entry or middle level assembly and packaging Engineer with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.

**What you'll do**

• Work with our OSAT in Asia to support company device packaging process improvements for NPI and volume manufacture
• Work with our CMs (contract manufactures) in Asia to support our optical engine and subcomponent assembly and process improvement for NPI and volume manufacture
• Project tracking weekly.
• Write technical reports and present results.
• Analyze data and track OSATs, Assembly houses, contract manufacturers Cp and Cpk for internal use.
• Support tests and reliability work at component level CoC, device level, optical engine, and module system assembly.
• Maintain the software and firmware support for testing and relevant setups.

**Required Qualifications**

• Minimal requirement is a bachelor's degree with 1 years of experience.
• The successful candidate need have English communication capability.
• Experience or knowledge of PCB assembly with SMT line
• Hands-on experience in laboratory experimentation and data analysis
• English communication capability is a must.
• Familiar with Microsoft Office.
• Fast learner is a must.
• Good work ethics and Maintain company confidential information are a must

**Preferred Qualifications**

• Higher degree with more experience is highly desired.
• Experience with microelectronic device packaging.
• Former experience of optical device packaging is highly desirable.
• Experience with hands-on testing of photonic and electronic. device/components.
• Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.
• Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
• Experience in SolidWorks and familiar with Engineering drawing is a plus.
• Data analysis experience such as JMPs is a plus; excel is OK.
• Programming and software maintenance skills are desired eg. python, or C++
• Understanding the microelectronic reliability tests and mechanical reliability tests are desirable.
• Experience in microsystem assembly such as hard disk assembly is a plus.

**Benefits**(subject to location and local regulations)

• Competitive salary and equity
• Flexible vacation and time-off policy
• Collaborative, fast-paced, and inclusive work environment
• Opportunity to work on cutting-edge technologies with a highly cross-functional team