3D Chiplet Engineer

Location: Leuven (Belgium), Grenoble (France), Nice (France) or remote

**About Us:

** Vertical Compute is an early-stage deep tech startup dedicated to pioneering next-generation memory technologies for advanced computing architecture. Our mission is to redefine the well-known trade-offs of semiconductor memory devices, ultimately enabling the future of computing. We are welcoming passionate, experienced, and forward-thinking colleagues to join our dynamic team and disrupt the industry together.

About What You Will Do:

We are seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define optimal interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation.

Key Responsibilities:

• **Integration Architecture & Process Definition:

**Develop and define architectures for 2.5D/3D stacking and heterogeneous integration of VIM dies. Work with design and technology teams to develop interconnect solutions that ensure high bandwidth and low latency.

• **Performance Analysis & Simulation:

**Conduct multi-physics simulations (thermal, electrical, mechanical) to analyze and optimize the performance and reliability of integrated systems.

• **Collaboration & Communication:

**Partner closely with design, process engineering, metrology, and system architecture teams. Participate in conferences, standardization bodies and industry events to promote or lead discussions about the future of chiplet integration.

• **Technical Leadership:

** Provide technical leadership and project management guidance to multidisciplinary teams.